Call for Papers

IEEE Communications Magazine

Interactive 3D Video Streaming

While the compression of 3D video data has drawn much attention in the research community in recent years, there remain numerous open issues in the streaming of 3D video. It is predicted that the amount of managed IP traffic consumed by 3D video will increase at a rate of over 130% per year until 2015, the highest of any content type. This presents many business opportunities for content creators, service providers, and device developers in the 3D video industry. Providing loss-resilient transport mechanism and satisfying delay constraints imposed by the streaming application are the traditional challenges of video streaming, made somewhat more difficult here due to the larger amount of data. However, these challenges acquire completely new dimensions in the context of interactive 3D video streaming, where the user's head motion relative to the screen may necessitate streaming and rendering a new viewpoint for the displayed content. Synchronization and scheduling issues between various data in 3D video streaming are also novel, due to the impact they have on the users perception of the displayed 3D scene.

The goal of this special issue is to present a review of the state-of-the-art and open problems in 3D video streaming. Submissions are invited in all areas related to interactive 3D video streaming, including:

Prospective authors should follow the IEEE Communications Magazine manuscript format described in the Authors Guidelines (http://www.comsoc.org/commag/paper-submission-guidelines). All articles must be submitted through the IEEE Manuscript Central (http://commag-ieee.manuscriptcentral.com), according to the following schedule:

Manuscript submission: October 1, 2012
Acceptance notification: December 30, 2012
Final manuscripts due: March 1, 2013
Publication: May 2013

Guest Editors
Ivan V. Bajic, Simon Fraser University, Canada
Gene Cheung, National Institute of Informatics, Japan
Pascal Frossard, Ecole Polytechnique Fédérale de Lausanne, Switzerland
Joern Ostermann, Leibniz Universitaet Hanover, Germany
Wai-tian Tan, Hewlett-Packard Laboratories, USA