2023 Vice President - Conferences Candidate
IEEE ComSoc sponsors more than 60 conferences with a total of 18,000 submissions and 7,000 published papers. These conferences involve 5,000 volunteers and attract 12,000 attendees. These statistics reveal how important our conferences are as one of the premier platforms for our society to maintain its leading role in communication and information technologies and for our members to strengthen their professional careers and technical contributions. To best serve those missions, our conferences must address the major challenges to increase attractiveness to industry and academia, maintain technical excellence, strengthen globalization, and improve operational efficiency.
I have had the privilege to serve ComSoc in a variety of technical programs. If elected as Vice-President for Conferences, I will rely on my diverse technical background and global working experience to
- Enhancing diversity (including gender, geographical region, seniority, ethnicity, etc.) among conference leadership team and volunteers.
- Shorten the conference submission-to-publication period and maintain the review quality by enhanced training of conference organizers and TPC members.
- Expand our conference portfolios by broadening conference participation from academia, industry and government and by keeping the conferences affordable.
- Enhance openness and fairness of conferences by improving the transparency of Steering Committee appointments, TPC Chair selections, and Paper award decisions.
- Increase student travel grants to facilitate conference participation of students.
My rich experience with various leadership positions within ComSoc, along with my professional experience in industry, academia and government make me an excellent candidate as the next ComSoc VP-Conferences to lead a strong conference team and achieve our objectives.
Chengshan Xiao is Chandler Weaver Professor and ECE Department Chair at Lehigh University, USA. He received his Ph.D. from University of Sydney, Australia. He has a unique blend of experience in industry, academia and government for over 30 years, developing products and conducting research in wireless communications and signal processing. He is a global citizen with working experience in China, Australia, Canada, Germany and the United States. He is an IEEE Fellow, a Fellow of the Canadian Academy of Engineering, a recipient of Humboldt Research Award. He has served as the Technical Program Chair of ICC 2010 and TPC Co-Chair of GLOBECOM 2017, Editor-in-Chief of IEEE Transactions on Wireless Communications. Within ComSoc, his leadership positions include Vice-President for Publications, elected member of Board of Governors, Conference Publications Director, Awards Committee Chair, Funding Chair of the Wireless Communications Technical Committee. He received ComSoc’s Joseph LoCicero Award and Harold Sobol Award.