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IEEE/CIC International Conference on Communications in China (ICCC 2014) to be held in Shanghai

IEEE/CIC International Conference on Communications in China (ICCC 2014) to be held in Shanghai

The third IEEE/CIC International Conference on Communications in China (ICCC 2014) will be held in the magnificent city of Shanghai, China, 13-15 October 2014.

ICCC 2014 aims at addressing a key theme on "Computing Communications towards Networked Societies." This conference will feature world-class plenary speakers, major technical symposia, industry and academic panels, tutorials and workshops.

Call for Papers! Chance to Win Best Paper Awards!

The technical program chairs invite the submission of original papers to following symposia for presentation and publication in the conference proceedings. Accepted and presented papers will be submitted to IEEE Xplore. Best paper awards will be selected from accepted papers.

Important dates
Paper Submission Deadline: 10 June 2014
Acceptance Notification: 15 August 2014
Camera-Ready: 31 August 2014


ICCC2014 will bring together contributions which include but are not limited to the following areas:

• WNM: Wireless Networking and Multimedia

• WCS: Wireless Communications Systems

• STC: Selected Topics in Communications

• SPC: Signal Processing for Communications

• SNBD: Social Networks and Big Data

• PSC: Privacy and Security in Communications

• OCSN: Optical Communication Systems and Networks

• CCT: Communication and Control Theory

Submission Guidelines

The submitted papers should be original, not published or currently under review for publications in any other journal or conference. All submissions must be formatted in standard IEEE camera-ready format and must be written in English and be at most six (6) printed pages in length, including figures. Papers should be submitted through EDAS System.
For full details, please visit the following website:

Industry & Academic Panels (IAP), Workshops & Tutorials

One of the key features of ICCC is its strong linkage to industry and applications via Industry and Academic Panels (IAP), which will be organized by industry and academic leaders to address the industry trends and key challenges to academia. Workshops and Tutorials on the latest technical and business issues in communications and networking are also highlighted features. 

Program Committees

General Chairs
Hui Liu, Shanghai Jiao Tong University
Xinsheng Zhang, China Institute of Communications
Wen Tong, Huawei Technologies

Steering Committees
Xuemin S. Shen, Chair, Univ. of Waterloo
Ke Gong, Vice Chair, CIC/CIE VP
Zhen Yang, Vice Chair, CIC VP
Khaled B. Letaief, HKUST, ComSoc VP
Kwang-Cheng Chen, Natl. Taiwan U.
Zhisheng Niu, Tsinghua Univ.
Jun Shu, Huawei Technologies
Steve Weinstein, CTTC Services Co.

Technical Program Co-chairs
Vincent Lau, HK University of Science &Technology
Meixia Tao, Shanghai Jiao Tong University
Guang Shi, China Institute of Communications
Teng Joon Lim, National University of Singapore

Publicity Co-chairs
Tomohiko Taniguchi, Fujitsu Labs. LTD.
Zhiyong Chen, Shanghai Jiao Tong University
Jie Pan, China Institute of Communications

Publication Chair
Jing Liu, Shanghai Jiao Tong University

Local Arrangement Chairs
Xiaohua Tian, Shanghai Jiao Tong University
Bin Ma, China Institute of Communications

Financial Chairs:
Bin Ma, China Institute of Communications
Bruce Worthman, IEEE ComSoc

Registration Chair
Wei Liu, Shanghai Jiao Tong University

Workshop & Tutorial Chairs
Yingjun (Angela) Zhang, Chinese University of HK
Yiqing Zhou, Chinese Academy of Sciences
Industry & Academic Panels (IAP) Chairs
Honglin Hu, WiCO
Charlie Zhang, Samsung Electronics

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