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Publications

Editor-in-Chief

O. A. Dobre
Memorial University, Canada

Associate Editor-in-Chief

M. Di Renzo
Paris-Saclay University/CNRS, France

Managing Editor

T. M. N. Kouatchah
IEEE ComSoc

Senior Editors

Lead Senior Editor
T. Q. Duong
Queen's University Belfast, UK

S. De
Indian Institute of Technology Delhi, India

I. B. Djordjevic
University of Arizona, USA

V. Eramo
Sapienza-University of Roma, Italy

S. C. Ergen
Koc University, Turkey

M. Flanagan
University College Dublin, Ireland

Z. Ma
Southwest JiaoTong University, China

P. Salvo Rossi
Kongsberg Digital, Norway

K. Tourki
Huawei Technologies, France

K. K. Wong
University College London, UK

M. Xiao
Royal Institute of Technology (KTH), Sweden

Advisory Board

J. Armstrong
Monash University, Melbourne, Australia

G. Chrisikos
Qualcomm, USA

G. K. Karagiannidis
Aristotle University of Thessaloniki, Greece

Y.-D. Lin
National Chiao Tung University, Taiwan

M. Stojanovic
Northeastern University, USA

M. Win
Massachusetts Institute of Technology, USA

Associate Editors

M. C. Aguayo-Torres
Universidad de Malaga, Spain

R. Aguero
University of Cantabria, Spain

A. Al-Fuqaha
Western Michigan University, USA

G. C. Alexandropoulos
University of Athens, Greece

O. Amin
King Abdullah University of Science and Technology (KAUST)SA

G. A. Aruma Baduge
Southern Illinois University, USA

M. Baldi
Università Politecnica delle Marche, Italy

E. Basar
Koç University, Turkey

E. Bastug
Nokia Bell Labs, France

E. Bedeer
Ulster University, UK

J. Ben-Othman
University of Paris 13, France

A. G. Bessios
University of South Alabama, USA

G. Böcherer
France Research Center, Huawei Technologies Co., France

G. Brante
Federal University of Technology-Parana, Brazil

A. S. Cacciapuoti
University of Naples Federico II, Italy

M. Caleffi
University of Naples Federico II, Italy

B. Canberk
Istanbul Technical University, Turkey

W. Cerroni
University of Bologna, Italy

M.-H. Cheung
The Chinese University of Hong Kong, Hong Kong

J. Choi
Pohang University of Science and Technology (POSTECH), Republic of Korea

X. Chu
University of Sheffield, UK

D. Ciuonzo
Network Measurement and Monitoring (NM2), Italy

T. De Cola
German Aerospace Center, Germany

G. Contestabile
Scuola Superiore Sant'Anna, Pisa, Italy

J. P. Coon
University of Oxford, UK

José A. Cortés
Universidad de Málaga, Spain

L. Dai
Tsinghua University, China

D. Darsena
University of Naples Parthenope, Italy

Y. Deng 
King’s College London, UK

B. Dezfouli
Santa Clara University, USA

M. Egan
INSA Lyon, France

H. ElSawy
King Fahd University of Petroleum and Minerals, Saudi Arabia 

A. Elshafie
Qualcomm Inc., USA

M. Erol-Kantarci 
University of Ottawa, Canada

C. Feng
The University of British Columbia, Canada

F. Gao
Tsinghua University, China

A. Garcia-Armada
Universidad Carlos III de Madrid, Spain

G. Geraci
Nokia Bell Labs, Ireland

H. Ghazzai 
Stevens Institute of Technology, USA

R. He
Beijing Jiaotong University, China

C. Jego
IMS Laboratory, University of Bordeaux, France

M. J. Khabbaz
Notre-Dame University, Zouk Mosbeh, Lebanon

M. Khabbazian
University of Alberta, Canada

M. R. A. Khandaker
Heriot-Watt University, UK

M. Koca
Boğaziçi University, Turkey

L. Lampe
University of British Columbia, Canada

H. Le-Minh
Northumbria University, UK

N. Lee
Pohang University of Science and Technology, Republic of Korea

X. Lei
Utah State University, USA

L. Liang
Intel Labs, USA

Y. Liu
South China University of Technology, China

Y. Liu
Queen Mary University of London, UK

S. Majhi
Indian Institute of Technology Patna, India 

B. Makki
Ericsson Research, Sweden

M. Maso
Nokia Bell Labs, France

B. Matuz
German Aerospace Center, Germany

S. Mazuelas
Basque Centre for Applied Mathematics, Spain

A. Mellouk
University of Paris Est Créteil-UPEC, France

N. Miridakis
University of West Attica, Greece and Jinan University, China

P. Monti
KTH Royal Institute of Technology, Sweden

L. Mucchi
University of Florence, Italy

H. Nam 
Hanyang University, Korea

K. Navaie
Lancaster University, UK

V.-D. Nguyen
Soongsil University, Korea

V. Nguyen-Son
Duy Tan University, Vietnam

K. Niu
Beijing University of Posts and Telecommunications, China

A. Noel
University of Ottawa, Canada

K. Ota
Muroran Institute of Technology, Japan

K. Pappi
Intracom S.A. Telecom Solutions, Greece

P. Patras
University of Edinburgh, UK

O. Popescu 
Old Dominion University, USA

J. Prieto
University of Salamanca, Spain

K. E. Psannis
University of Macedonia, Greece

C. Qi
Southeast University, China

Z. Qin
Lancaster University, UK

E. Radoi
Université de Bretagne Occidentale, France

K. Rajawat
Indian Institute of Technology Kanpur, India

M. Sepulcre Ribes
Universidad Miguel Hernández de Elche, Spain

A. Garcia Saavedra
NEC Laboratories Europe

H. Saeedi
Tarbiat Modares University, Iran

M. Safari
University of Edinburgh, UK

J. B. Seo
Indian Institute of Technology Delhi, India

M. Z. Shakir
University of the West of Scotland, UK

B. Shihada
KAUST, SA

B. Smida
University of Illinois at Chicago, USA

S. Sorour
University of Idaho, USA

H. Tabassum
York University, Canada

H. Tao
UNC-Charlotte, USA

M. Tornatore
Politecnico di Milano, Italy

N. H. Tran
University of Akron, USA

M. Vaezi
Villanova University, USA

F. Wang
Beijing Jiaotong University, China

C. C. Wen
National Sun Yat-sen University, Taiwan

Q. Wu
National University of Singapore, Singapore

Y. Wu
University of Erlangen, Germany

Y. Xiao
University of Electronic Science and Technology of China, China

S. Yu
Deakin University, Australia

H. Zhang
University of Science and Technology Beijing, China

J. Zhang
Beijing Jiaotong University, China

J. Zhang 
Nanjing University of Posts and Telecommunications, China

W. Zhang
Xi'an Jiaotong University, China

Z. Zhao 
Beijing University of Posts and Telecommunications, China

G. Zheng
Loughborough University, UK

N. Zorba
Qatar University, Qatar