Editor-in-Chief
Antonio Sanchez-Esguevillas
Telefonica, Spain
Associate Editors-in-Chief
Alberto Perotti
Huawei Technologies, Sweden
Ravi Subrahmanyan
Analog Devices, USA
Director of Magazines
Nei Kato
Tohoku University, Japan
Advisory Board
Tarek S. El-Bawab
The American University of Nigeria, Nigeria
Nelson Fonseca
State University of Campinas, Brazil
Osman Gebizlioglu
Huawei Technologies, USA
Steve Gorshe
PMC-Sierra, Inc., USA
Sean Moore
Centripetal Networks, USA
Series Editors
Artificial Intelligence and Data Science for Communications
Yongmin Choi
KT Corporation, South Korea
Ahmed Kamal
Iowa State University, USA
Malamati Louta
University of Western Macedonia, Greece
Design and Implementation of Devices, Circuits, and Systems
Bernard Fong
Auckland University of Technology, New Zealand
Haesik Kim
VTT Technical Research Centre of Finland, Finland
Vyasa Sai
Intel Corporation, USA
Internet of Things
Sergio Fortes
Universidad de Málaga, Spain
Israat Haque
Dalhousie University, Canada
Prasant K. Misra
TCS (Research & Innovation), India
Luca Rose
Nokia Bell Labs, France
Military Communications and Networks
Kevin Chan
United States Army Research Laboratory, USA
Peter Han Joo Chong
Auckland University of Technology, New Zealand
Nils Agne Nordbotten
Thales Norway, Norway
Mobile Communications and Networks
Wanshi Chen
Qualcomm Inc., USA
Ilker Demirkol
Universitat Politecnica de Catalunya, Spain
Miraj Mostafa
American Tower Corporation (ATC), USA
Stefano Ruffini
Ericsson, Italy
Network Softwarization and Management
Walter Cerroni
University of Bologna, Italy
Oscar Mauricio Caicedo Rendón
Universidad del Cauca, Colombia
Noura Limam
University of Waterloo, Canada
Optical Communications and Networks
Mathieu Chagnon
Nokia Bell Labs, Germany
Itsuro Morita
KDDI Research, Inc., Japan
Technical Editors
Walter Cerroni
University of Bologna, Italy
Ilker Demirkol
Universitat Politecnica de Catalunya, Spain
Frank Joseph Effenberger
Huawei Technologies Co., Ltd., USA
Ahmed Kamal
Iowa State University, USA
Ivo Maljevic
TELUS; University of Toronto, Canada
Mohamed M. A. Moustafa
Egyptian Russian University, Egypt
Alberto Perotti
Huawei Technologies, Sweden
Stefano Ruffini
Ericsson (GFTE ER NT Optical Systems), Italy
Antonio Sanchez-Esguevillas
Telefonica, Spain
Mostafa Hashem Sherif
AT&T, USA
Ravi Subrahmanyan
Analog Devices, USA
Danny H. K. Tsang
Hong Kong University of Science and Tech., China
Associate Technical Editors
Ozgu Alay
University of Oslo, Norway
Anwer Al-Dulaimi
EXFO, Canada
Roberto Bruschi
CNIT, Italy
Majid Butt
Nokia Bell Labs, France
Xiaojun (Matt) Cao
Georgia State University, USA
Mathieu Chagnon
Nokia Bell Labs, Germany
Wanshi Chen
Qualcomm Inc., USA
Xi Chen
Nokia Bell Labs, USA
Luca Chiaraviglio
University of Rome Sapienza, Italy
Yongmin Choi
KT Corporation, South Korea
Tasos Dagiuklas
London South Bank University, UK
Ngoc-Dung Dao
Huawei Technologies, Canada
Jaafar Elmirghani
University of Leeds, UK
Simone Ferlin
Ericsson AB, Sweden
Sergio Fortes
Universidad de Málaga, Spain
Haris Gacanin
Nokia Bell Labs, Belgium
Fabrizio Granelli
University of Trento, Italy
Shuangfang Han
Chinamobile Research Institute, Beijing, China
Xiaolin Hou
DOCOMO Beijing Labs, China
Zeeshan Kaleem
COMSATS Institute of Information Technology, Pakistan
Atta ur Rehman Khan
King Saud University, Saudi Arabia
Haesik Kim
VTT Technical Research Centre of Finland, Finland
Neeraj Kumar
Thapar University Patiala, India
Gunes Karabulut Kurt
Istanbul Technical University, Turkey
Jong-Seok Lee
Yonsei University, South Korea
Zander (Zhongding) Lei
Institute for Infocomm Research, Singapore
Noura Limam
University of Waterloo, Canada
Huichun Liu
QUALCOMM Wireless Communication Technologies (China) Limited, China
Jochen Maes
Nokia Bell Labs, Belgium
Jordan Melzer
TELUS, Ottawa, Canada
Juan Moreno
Universidad Politécnica de Madrid / Metro de Madrid S.A., Spain
Taras Maksymyuk
Lviv Polytechnic National University, Ukraine
Mario Marchese
University of Genoa, Italy
Mohammad Abdul Matin
North South University, Bangladesh
Prasant Misra
TATA Consultancy Services Ltd., India
Itsuro Morita
KDDI Research, Inc., Japan
Miraj Mostafa
American Tower Corporation (ATC), USA
Sharief Oteafy
DePaul University, USA
Laura Pierucci
University of Florence (UNIFI), Italy
Michele Polese
Northeastern University, USA
Yi Qian
University of Nebraska, USA
Daji Qiao
Iowa State University, Ames, Iowa, USA
Oscar Mauricio Caicedo Rendón
Universidad del Cauca, Colombia
Jason Wade Rupe
CableLabs, Louisville, CO, USA
Vyasa Sai
Intel Corporation, USA
Abdallah Shami
The University of Western Ontario, Canada
Vishal Sharma
Soonchunhyang University, South Korea
Srikathyayani Srikanteswara
Intel Corporation, USA
Abd-Elhamid M. Taha
Alfaisal University, Saudi Arabia
Anna Maria Vegni
Roma Tre University, Italy
Natalija Vlajic
York University, Canada
Katarzyna Wac
University of Geneva, Switzerland
Robert Wojcik
AGH University of Science and Technology, Poland
Hui Yang
Beijing University of Posts and Telecommunications, China
Kun Yang
University of Essex, UK
Shui Yu
Deakin University, Australia
Zhiwen Yu
Northwestern Polytechnical University, China
Syed Ali Raza Zaidi
University of Leeds, UK
Zhen Zhou
Intel Labs, Intel Corporation, USA
Column Editors
Book Reviews
Mubashir Husain Rehmani
Cork Institute of Technology, Ireland
Director of Production and Portfolio Management
Christina Dzikowski
IEEE Communications Society
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Production Specialist
Jennifer Porcello
IEEE Communications Society
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Associate Editor
Catherine Kemelmacher
IEEE Communications Society
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Phone: +1 (212) 705-8962
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Digital Production Manager
Susan Lange
IEEE Communications Society
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