Editor-in-Chief
Yi Qian
University of Nebraska-Lincoln
Associate Editor-in-Chief
Yi Qian
Dept. Computer and Electronics Engineering
University of Nebraska - Lincoln
1110 South 67th Street
Omaha, NE 68182-0672, USA
Director of Magazines
Yuguang "Michael" Fang
Dept. Electrical and Computer Engineering
University of Florida
1064 Center Drive
Gainesville, FL 32611, USA
Phone: +1 (352) 846-3043
Senior Advisors
Hamid Ahmadi
Motorola, USA
Hsiao-Hwa Chen
National Cheng Kung University, Taiwan
Yuguang (Michael) Fang
University of Florida, USA
David Goodman
Polytechnic University, USA
Abbas Jamalipour
University of Sydney, Australia
Thomas F. La Porta
Penn State University, USA
Tero Ojanperä
Nokia, Finland
Michele Zorzi
University di Padova, Italy
Advisory Board
Donald Cox
Stanford University, USA
Uday Desai
Indian Institute of Technology-Hyderabad, India
Mahmoud Naghshineh
IBM Watson Research Center, USA
Kaveh Pahlavan
Worcester Polytechnic Institute, USA
Mahadev Satyanarayanan
CMU, USA
Hequan Wu
Chinese Academy of Engineering, China
IEEE Vehicular Technology Liaison
Theodore Rappaport
The University of Texas at Austin, USA
IEEE Computer Society Liaison
Mike Liu
Ohio State University, USA
Technical Editors
Abderrahim Benslimane
University of Avignon, France
Gilberto Berardinelli
Aalborg University, Denmark
Han-Chieh Chao
National I-Lan University, Taiwan
Periklis Chatzimisios
Alexander TEI of Thessaloniki, Greece
Xiuzheng Cheng
George Washington University, USA
Xiaojiang Du
Temple University, USA
Chuan Heng Foh
The University of Surrey, UK
Xiaohu Ge
Huazhong University of Science and Technology, China
Mohsen Guizani
University of Idaho, USA
Ekram Hossain
University of Manitoba, Canada
Rose Qingyang Hu
Utah State University, USA
Minho Jo
Korea University, Korea
Nei Kato
Tohoku University, Japan
SuKyoung Lee
Yonsei University, Korea
Phone Lin
National Taiwan University, Taiwan
Ying-Dar Lin
National Chiao-Yung University, Taiwan
Stanley Kuang-Hao Liu
National Cheng Kung University, Taiwan
Javier Lopez
University of Malaga, Spain
Aarne Mämmelä
VTT Technical Research Centre of Finland
Weixiao Meng
Harbin Institute of Technology, China
Mohammad S. Obaidat
Fordham University, USA
Kui Ren
Illinois Institute of Technology, USA
Joel Rodrigues
University of Beira Interior, Portugal
Kamran Sayrafian
NIST, USA
John Shea
University of Florida, USA
Athanasios V. Vasilakos
Luleå University of Technology, Sweden
Alexey Vinel
Halmstad University, Sweden
Yonggang Wen
Nanyang Technological University, Singapore
Christian Wietfeld
TU Dortmund University of Technology, Germany
Sherali Zeadally
University of Kentucky, USA
Yanchao Zhang
Arizona State University, USA
Liang Zhou
Nanjing University of Posts and Telecommunications, China
Column Editors
Book Reviews
Satyajayant Misra
New Mexico State University, USA
Industrial Perspectives
Chun-Yen Wang
Industrial Technology Research Institute (ITRI), Taiwan
Scanning the Literature
Pan Li
Case Western Reserve University, USA
Spectrum Policy and Regulatory Issues
Michael Marcus
Marcus Spectrum Solutions, USA
Publications Staff
Assistant Publisher
Joseph Milizzo
IEEE Communications Society
3 Park Ave, 17th Floor
New York, NY 10016, USA
Phone: +1 (212) 705-8960
Fax: +1 (212) 705-8999
Production Specialist
Jennifer Porcello
IEEE Communications Society
3 Park Ave, 17th Floor
New York, NY 10016, USA
Phone: +1 (212) 705-8961
Fax: +1 (212) 705-8999
Associate Editor
Catherine Kemelmacher
IEEE Communications Society
3 Park Ave, 17th Floor
New York, NY 10016, USA
Phone: +1 (212) 705-8962
Fax: +1 (212) 705-8999
Digital Production Manager
Susan Lange
IEEE Communications Society
3 Park Ave, 17th Floor
New York, NY 10016, USA
Phone: +1 (212) 705-8963
Fax: +1 (212) 705-8999